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AMD / CDNA 3

Instinct MI300X OAM

MI300X OAM accelerator. Validate the complete platform and ROCm software compatibility.

MANUFACTURER REFERENCE

Published specifications

Memory capacity
192 GB
Memory type
HBM3
Memory bandwidth
5.3 TB/s
Power
750 W typical board power
Connectivity
PCIe Gen5 x16; 7 Infinity Fabric links
Form factor
OAM module
Primary workloads
Generative AI; HPC; inference
Software stack
ROCm

Source last reviewed 2026-10-17. Check the linked product variant and system documentation before using values in a configuration.

Open manufacturer source ↗